固晶胶
固晶工艺需要使用绝缘或导电胶把芯片粘接在指定框架或基板上。宝特威研发了系列类型固晶胶用于此工艺。
产品的基系选择依赖于终端应用的可靠性要求：
环氧树脂,
丙烯酸树脂,
聚合物，
混合型树脂.
宝特威的系列固晶胶导热率高，固化速度快，且拥有低膨胀系数和出气率。
Technical description
Name/品名
Color/颜色
Chemistry/基系
Density/比重
Viscosity at 25°C (mPa.s)/粘度
TG/玻璃化温度
CTE（ppm/°C）/热膨胀系数
Modulous(GPa)/模量
Thermal conductivity (W/(m.K)/导热率
Electrical resistance (mΩ.cm)/电阻率
Use/用途
Open time/使用寿命
Polymerization/固化条件
Storage/储存寿命
PROTAVIC® ACA 20513
Silver
Acrylate
4.4
9500
55°C
36
3.7
>18
<0.1
MOSFET
24 hours
30 min at 200°C
6 months at -20°C
PROTAVIC® ACC 20700
Silver
Cyanate ester
4
10000
235°C
33
10.5
4.1
2.5
Hermetic IC
20 hours
30 min at 150°C+ 15 min at 300°C
1 year at -40°C
PROTAVIC® ACE 34560(Formerly CA3823-X56)
Silver
Epoxy
3.5
117000
130°C
44
3.1
2.8
0.3
IC, LED
2 days
60 min at 175°C
1 year at -40°C
PROTAVIC®
ACH 35005
Silver
Hybrid
4
6500
193°C
45
12
15
0.07
IC, LED
24 hours
60 min at 175°C
1 year at -40°C
PROTAVIC® ACA 20513
Silver
Acrylate
Chemistry/基系4.4
Density/比重9500
Viscosity at 25°C (mPa.s)/粘度55°C
TG/玻璃化温度36
CTE（ppm/°C）/热膨胀系数3.7
Modulous(GPa)/模量>18
Thermal conductivity (W/(m.K)/导热率<0.1
Electrical resistance (mΩ.cm)/电阻率MOSFET
Use/用途24 hours
Open time/使用寿命30 min at 200°C
Polymerization/固化条件6 months at -20°C
Storage/储存寿命PROTAVIC® ACC 20700
Silver
Cyanate ester
Chemistry/基系4
Density/比重10000
Viscosity at 25°C (mPa.s)/粘度235°C
TG/玻璃化温度33
CTE（ppm/°C）/热膨胀系数10.5
Modulous(GPa)/模量4.1
Thermal conductivity (W/(m.K)/导热率2.5
Electrical resistance (mΩ.cm)/电阻率Hermetic IC
Use/用途20 hours
Open time/使用寿命30 min at 150°C+ 15 min at 300°C
Polymerization/固化条件1 year at -40°C
Storage/储存寿命PROTAVIC® ACE 34560(Formerly CA3823-X56)
Silver
Epoxy
Chemistry/基系3.5
Density/比重117000
Viscosity at 25°C (mPa.s)/粘度130°C
TG/玻璃化温度44
CTE（ppm/°C）/热膨胀系数3.1
Modulous(GPa)/模量2.8
Thermal conductivity (W/(m.K)/导热率0.3
Electrical resistance (mΩ.cm)/电阻率IC, LED
Use/用途2 days
Open time/使用寿命60 min at 175°C
Polymerization/固化条件1 year at -40°C
Storage/储存寿命
PROTAVIC®
ACH 35005
Silver
Hybrid
Chemistry/基系4
Density/比重6500
Viscosity at 25°C (mPa.s)/粘度193°C
TG/玻璃化温度45
CTE（ppm/°C）/热膨胀系数12
Modulous(GPa)/模量15
Thermal conductivity (W/(m.K)/导热率0.07
Electrical resistance (mΩ.cm)/电阻率IC, LED
Use/用途24 hours
Open time/使用寿命60 min at 175°C
Polymerization/固化条件1 year at -40°C
Storage/储存寿命