固晶胶
为响应智能卡行业大批量生产诉求，宝特威推出了系列速固型固晶胶，全方位匹配传统的引线键合制程和新型的倒装芯片制程。
宝特威系列固晶胶包括导电胶和绝缘胶，作业性好，粘接力高，完美匹配模块产品的大生产制程。
系列产品如下图表中所示。
Technical description
Name/品名
Color/颜色
Chemistry/基系
Density/比重
Viscosity at 25°C (mPa.s)/粘度
TG/玻璃化温度
CTE（ppm/°C）/热膨胀系数
Shore hardness/硬度
Thermal conductivity (W/(m.K)/导热率
Open time/使用寿命
Polymerization/固化条件
Storage/储存寿命
PROTAVIC® ANE 10713
colorless
Epoxy
1.1
9000
110°C
95
D86
-
1 month
1 min at 150°C
1 min at 150°C
PROTAVIC® ANE 30100
Black
Epoxy
1,2
7000
110°C
55
-
-
1 week
60 min at 120°C
6 months at -20°C
PROTAVIC® ATE 10130
White
Epoxy
1.4
-
75°C
55
-
0.7
5 days
90 min at 75°C
1 year at -20°C
PROTAVIC® ANE 10713
colorless
Epoxy
Chemistry/基系1.1
Density/比重9000
Viscosity at 25°C (mPa.s)/粘度110°C
TG/玻璃化温度95
CTE（ppm/°C）/热膨胀系数D86
Shore hardness/硬度-
Thermal conductivity (W/(m.K)/导热率1 month
Open time/使用寿命1 min at 150°C
Polymerization/固化条件1 min at 150°C
Storage/储存寿命PROTAVIC® ANE 30100
Black
Epoxy
Chemistry/基系1,2
Density/比重7000
Viscosity at 25°C (mPa.s)/粘度110°C
TG/玻璃化温度55
CTE（ppm/°C）/热膨胀系数-
Shore hardness/硬度-
Thermal conductivity (W/(m.K)/导热率1 week
Open time/使用寿命60 min at 120°C
Polymerization/固化条件6 months at -20°C
Storage/储存寿命PROTAVIC® ATE 10130
White
Epoxy
Chemistry/基系1.4
Density/比重-
Viscosity at 25°C (mPa.s)/粘度75°C
TG/玻璃化温度55
CTE（ppm/°C）/热膨胀系数-
Shore hardness/硬度0.7
Thermal conductivity (W/(m.K)/导热率5 days
Open time/使用寿命90 min at 75°C
Polymerization/固化条件1 year at -20°C
Storage/储存寿命